（1） Ultra fine and high-purity silicon micro powder has become a hot topic in the industry development

Ultra fine silicon powder material is a new material that has gradually developed in recent years. Ultra fine silicon powder has the characteristics of small particle size, large specific surface area, high chemical purity, and good filling properties. It has been widely used in various fields such as copper-clad laminates, adhesives, rubber, coatings, engineering plastics, pharmaceuticals, papermaking, and daily chemical products due to its superior stability, reinforcement, thickening, and thixotropy. It provides the foundation and technical guarantee for the development of related industries with new materials and enjoys the reputation of "industrial MSG" and "the origin of materials science". High purity silicon micro powder generally refers to silicon micro powder with SiO2 content higher than 99.9%, mainly used in industries such as IC integrated circuits and quartz glass. Its products are widely used in large-scale and ultra large scale integrated circuits, optical fibers, lasers, aerospace, and military, and are essential materials for high-tech industries. Some developed countries even consider it as a strategic goal to achieve. High purity silicon micro powder will become the basic material for the electronics industry in the 21st century, with a rapidly increasing demand and a promising market outlook.

Fused silica 

（2） Spherical silicon micro powder becomes the development direction of the industry

At present, there are few enterprises that can produce spherical silicon micro powder, and only those with advanced technology in the department have production capacity. In recent years, the computer market and network information technology market have developed rapidly, with increasing CPU integration and faster computing speeds. There are more and more home computers and internet users, and the microelectronics industry, which relies on technology, requires not only ultrafine but also high-purity and low radioactive element content for large-scale and ultra large scale integrated circuit packaging materials, especially for the spherical shape of particles.

（3） Deepening the development of surface modification technology

With the continuous development of downstream application markets, the quality and stability requirements for non-metallic mineral powder materials are constantly improving. Currently, China's non-metallic mineral powder material technology cannot meet the application needs well. Powder surface and interface modification technology will become one of the main development directions for non-metallic mineral powder processing technology. Powder surface modification refers to the treatment of the surface or interface of powder materials using physical, chemical, mechanical and other methods, with the purpose of changing the chemical properties of the powder material surface to meet the needs of modern new materials, new processes and new technologies. Currently, the main methods used for surface modification of non-metallic mineral powders include surface chemical coating, precipitation reaction coating, intercalation modification, etc.